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Thursday, November 5, 2020 | History

3 edition of IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium found in the catalog.

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (29th 2004 San Jose, Calif.)

IEEE/CPMT/SEMI 29th International Electronics Manufacturing Technology Symposium

July 14-16, 2004, the Marriott Hotel, San Jose, CA, U.S.A.

by IEEE/CPMT/SEMI International Electronics Manufacturing Technology Symposium (29th 2004 San Jose, Calif.)

  • 2 Want to read
  • 9 Currently reading

Published by IEEE in Piscataway, N.J .
Written in English

    Subjects:
  • Electronic industries -- Congresses.,
  • Electronic packaging -- Congresses.,
  • Electronic apparatus and appliances -- Design and construction -- Congresses.,
  • Semiconductors -- Design and construction -- Congresses.,
  • Thin film devices -- Design and construction -- Congresses.,
  • Ball grid array technology -- Congresses.

  • Edition Notes

    Other titlesIEMT 2004, International Electronics Manufacturing Technology Symposium
    Statement[co-sponsored by IEEE, CPMT, SEMI].
    GenreCongresses.
    ContributionsSemiconductor Equipment and Materials International., Components, Packaging & Manufacturing Technology Society., Institute of Electrical and Electronics Engineers.
    Classifications
    LC ClassificationsTK7801 .I4145 2004
    The Physical Object
    Paginationxii, 354 p. :
    Number of Pages354
    ID Numbers
    Open LibraryOL3328498M
    ISBN 100780385829, 0780385837
    LC Control Number2004303237
    OCLC/WorldCa56036344

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系統識別號: u 論文名稱(中文) 父母教養方式、教師支持與國三學生偏差行為之關聯性研究. Mutisite - Free download as PDF File .pdf), Text File .txt) or read online for free.Encapsulation Technologies for Electronic Applications coated with liquid plastic encapsulant and cured.

The reel of radial-spread, coated chips is then sent to the substrate (or circuit card) assembly line, where individual chips are excised from the tape, the leads are formed, and the package is .Wire Bonding in Microelectronics About the Author George G.

Harman is a retired Fellow of the National Institute of Standards and Technology (NIST). He has a BS in industrial physics from Virginia Polytechnic Institute & State University and an MS in physics from the University of Maryland ().